Talk is cheap and TSMC’s plan to bolster its US expansion by another $100 billion is just that — talk. Riding high on yet another quarter of AI-fueled sales, which topped $40 billion, Taiwanese foundry giant TSMC announced plans this week to increase its US fab footprint to 12 facilities, totaling $265 billion of investment. But making good on that promise is easier said than done, and if history tells us anything, it’s that plans change. As you may recall, Intel invested $30 billion to build a pair of new fabs in Arizona, and also planned to spend €30 billion on a megafab in Magdeburg, Germany; $25 billion on a fab in Israel; and $20 billion on a manufacturing plant in Ohio. So far, only one of the Arizona plants has materialized. The German facility has been cancelled, the Israel site delayed indefinitely, and the Ohio foundry expansion pushed until at least 2030. All of that is to say, TSMC’s leaders can make any plan they like, but it doesn’t mean the cash the will actually be invested or the facilities built. And even if TSMC does pack the Arizona desert with the dozen wafer fabs and advanced packaging facilities it’s promised, it could be decades before we see them come online. These are some of the most complex facilities in the world. The site selection, permitting, and support buildings required to supply power and water, and to condition the air for the clean rooms, takes years and billions of dollars to bring online before the first lithography machines from ASML can be deployed and tested. To put things in perspective, since announcing its first leading-edge fab in the US during Trump’s last administration, TSMC has managed to build just two fab sites and break ground on a third, all at a cost of $65 billion. The first of these came online in late 2024 with Apple and Nvidia announced as flagship customers early last year. The second fab, which is slated to produce chips based on the foundry giant’s 3 nm process tech, isn’t slated to come online until the
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